Multilayer FPC Welding Rigid-Flex Board
Contact Info
- Add:深圳市宝安区沙井街道步涌社区同富裕工业区中熙工业园F栋厂房202, Zip: 518100
- Contact: 戴希根
- Tel:0755-23703482
- Email:dai15172070680@163.com
Other Products
Copper Clad Laminate (Copper Film)
Copper foil: Generally divided into electrolytic copper and rolled copper. Common thicknesses include 1oz, 1/2oz, and 1/3oz.
Substrate film: Common thicknesses are 1mil and 1/2mil.
Adhesive: Thickness determined according to customer requirements.
Cover Film
Cover film: Used for surface insulation. Common thicknesses are 1mil and 1/2mil.
Adhesive: Thickness determined according to customer requirements.
Release paper: Prevents the adhesive from picking up foreign matter before lamination; facilitates operation.
PI Stiffener Film
Stiffener: Reinforces the mechanical strength of FPC, facilitating surface mounting operations. Common thicknesses range from 3mil to 9mil.
Adhesive: Thickness determined according to customer requirements.
Release paper: Prevents the adhesive from picking up foreign matter before lamination.
EMI: Electromagnetic shielding film, protects the circuits on the board from external interference (strong electromagnetic areas or interference-prone areas).
| Industry Category | Electronic-Components-Supplies |
|---|---|
| Product Category | |
| Brand: | 单双面多层软硬结合柔性电路板设计 |
| Spec: | 纯铜箔软硬结合FR4钢片补强电路板 |
| Stock: | |
| Origin: | China / Guangdong / Shenshi |
